Back to all jobs
E
- Employment
- Full-time
- Seniority
- Staff
About the role
Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, a
Read the full description on the original posting.
759,000+ hidden jobs like this
eliyan and thousands of companies post here first — often days before LinkedIn or Indeed. Your first 5 applications are free; go Pro to apply without limits.
Everything Pro unlocks:
- Unlimited applications — free stops at 5
- Track every application in one place
- Apply straight to the source, one click
- Save & organize roles you love
- Roles pulled from company boards before the big sites
