System Engineer Expert (Beijing based, Semiconductor, Relocation Provided)

Key Responsibilities

• Lead product requirements analysis and define system, architecture, and module-level functional specifications for advanced semiconductor manufacturing equipment.
• Develop and evaluate technical solutions, system architectures, and product configuration strategies to meet performance, reliability, and manufacturability requirements.
• Drive feasibility studies, system verification activities, and implementation plans for new product development initiatives.
• Conduct system-level analysis of complex technical issues and lead the development of effective solutions throughout the product lifecycle.
• Define and maintain product standards, Common Building Blocks (CBBs), system design methodologies, and intellectual property strategies.
• Lead the definition of technical interfaces across multiple engineering domains and coordinate the resolution of cross-functional technical conflicts.
• Monitor and drive resolution of key R&D challenges across subsystem teams, ensuring technical risks are identified and mitigated.
• Conduct technical reviews and provide system-level guidance throughout product development, validation, and production readiness activities.
• Support debugging, verification, and optimisation of process parameters and equipment performance.
• Drive continuous improvement initiatives by analysing field issues, identifying root causes, and implementing design enhancements.

Skills, Knowledge & Expertise

• Master's degree or above in Mechanical Engineering, Electrical Engineering, Automation, Mechatronics, Optics, Systems Engineering, or a related discipline.
• 8+ years of R&D experience within the semiconductor equipment, opto-mechatronics, or high-precision automation industries.
• Proven experience in system architecture, system engineering, or product development for complex semiconductor manufacturing equipment.
• Strong understanding of motion control systems and hands-on experience in one or more of the following areas:
  • High-precision mechanical systems
  • Motion and control systems
  • Optical systems
  • Opto-mechatronic integration
• Experience developing semiconductor equipment such as hybrid bonding, wafer bonding, thermocompression bonding, advanced packaging, or other high-precision manufacturing platforms.
• Strong systems thinking with the ability to analyse complex multidisciplinary problems and develop effective technical solutions.
• Experience defining technical requirements, system architectures, interface specifications, and product standards.
• Demonstrated ability to lead cross-functional technical discussions, coordinate stakeholders, and resolve technical conflicts across engineering teams.
• Strong communication, collaboration, and technical leadership skills.